? semiconductor components industries, llc, 2006 april, 2006 ? rev. 5 1 publication order number: MJF47/d MJF47 high voltage power transistor isolated package applications designed for line operated audio output amplifiers, switching power supply drivers and other switching applications, where the mounting surface of the device is required to be electrically isolated from the heatsink or chassis. features ? electrically similar to the popular tip47 ? 250 v ceo(sus) ? 1 a rated collector current ? no isolating washers required ? reduced system cost ? ul recognized, file #e69369, to 3500 v rms isolation ? pb ? free package is available* ???????????????????? ???????????????????? maximum ratings ???????????? ???????????? ???? ???? ???? ???? ??? ??? ???????????? ???????????? collector ? emitter voltage ???? ???? ???? ???? ??? ??? ???????????? ???????????? ? base voltage ???? ???? ???? ???? ??? ??? ???????????? ???????????? ? base voltage ???? ???? ???? ???? ??? ??? ???????????? ? ?????????? ? ? ?????????? ? ???????????? rms isolation voltage (note 1) test no. 1 per figure 10 test no. 2 per figure 11 test no. 3 per figure 12 (for 1 sec, r.h. < 30%, t a = 25 c) ???? ? ?? ? ? ?? ? ???? v isol ???? ? ?? ? ? ?? ? ???? 4500 3500 1500 ??? ? ? ? ? ? ? ??? v ???????????? ???????????? ? continuous ? peak ???? ???? ???? ???? ??? ??? ???????????? ???????????? ? continuous ???? ???? ???? ???? ??? ??? ???????????? ? ?????????? ? ???????????? total power dissipation (note 2) @ t c = 25 c derate above 25 c ???? ? ?? ? ???? p d ???? ? ?? ? ???? 40 0.31 ??? ? ? ? ??? w w/ c ???????????? ???????????? c derate above 25 c ???? ???? ???? ???? ??? ??? c ???????????? ???????????? ???? ???? ???? ???? ??? ??? c ???????????????????? ???????????????????? thermal characteristics ???????????? ???????????? ???? ???? ???? ???? ??? ??? ???????????? ???????????? thermal resistance, junction ? to ? ambient ???? ???? ja ???? ???? ??? ??? c/w ???????????? ???????????? ? to ? case (note 2) ???? ???? jc ???? ???? ??? ??? c/w ???????????? ???????????? ???? ???? ???? ???? ??? ??? c maximum ratings are those values beyond which device damage can occur. maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. if these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. proper strike and creepage distance must be provided. 2. measurement made with thermocouple contacting the bottom insulated surface (in a location beneath the die), the devices mounted on a heatsink with thermal grease and a mounting torque of 6 in. lbs. *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. device package shipping ordering information MJF47 to ? 220 fullpack to ? 220 fullpack case 221d style 2 50 units/rail 3 1 npn silicon power transistor 1 ampere 250 volts, 28 watts 2 http://onsemi.com MJF47g to ? 220 fullpack (pb ? free) 50 units/rail g = pb ? free package a = assembly location y = year ww = work week MJF47g ayww marking diagram *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d.
MJF47 http://onsemi.com 2 ????????????????????????????????? ????????????????????????????????? (t c = 25 c unless otherwise noted) ????????????????????? ????????????????????? characteristic ????? ????? ???? ???? ??? ??? ???? ???? ????????????????????????????????? ????????????????????????????????? ????????????????????? ????????????????????? collector ? emitter sustaining voltage (note 3) (i c = 30 madc, i b = 0) ????? ????? ???? ???? ??? ??? ? ???? ???? vdc ????????????????????? ? ??????????????????? ? ????????????????????? collector cutoff current (v ce = 150 vdc, i b = 0) ????? ? ??? ? ????? i ceo ???? ? ?? ? ???? ? ??? ? ? ? ??? 0.2 ???? ? ?? ? ???? madc ????????????????????? ? ??????????????????? ? ????????????????????? collector cutoff current (v ce = 350 vdc, v be = 0) ????? ? ??? ? ????? i ces ???? ? ?? ? ???? ? ??? ? ? ? ??? 0.1 ???? ? ?? ? ???? madc ????????????????????? ? ??????????????????? ? ????????????????????? emitter cutoff current (v be = 5 vdc, i c = 0) ????? ? ??? ? ????? i ebo ???? ? ?? ? ???? ? ??? ? ? ? ??? 1 ???? ? ?? ? ???? madc ????????????????????????????????? ????????????????????????????????? on characteristics (note 3) ????????????????????? ? ??????????????????? ? ? ??????????????????? ? ????????????????????? dc current gain (i c = 0.3 adc, v ce = 10 vdc) (i c = 1 adc, v ce = 10 vdc) ????? ? ??? ? ? ??? ? ????? h fe ???? ? ?? ? ? ?? ? ???? 30 10 ??? ? ? ? ? ? ? ??? 150 ? ???? ? ?? ? ? ?? ? ???? ? ????????????????????? ? ??????????????????? ? ????????????????????? collector ? emitter saturation voltage (i c = 1 adc, i b = 0.2 adc) ????? ? ??? ? ????? v ce(sat) ???? ? ?? ? ???? ? ??? ? ? ? ??? 1 ???? ? ?? ? ???? vdc ????????????????????? ????????????????????? ? emitter on voltage (i c = 1 adc, v ce = 10 vdc) ????? ????? ???? ???? ? ??? ??? 1.5 ???? ???? ????????????????????????????????? ????????????????????????????????? dynamic characteristics ????????????????????? ? ??????????????????? ? ????????????????????? current gain ? bandwidth product (i c = 0.2 adc, v ce 10 vdc, f = 2 mhz) ????? ? ??? ? ????? f t ???? ? ?? ? ???? 10 ??? ? ? ? ??? ? ???? ? ?? ? ???? mhz 3. pulse test: pulse width 300 s, duty cycle 2%. typical characteristics 0.02 figure 1. dc current gain i c , collector current (amps) 2 0.1 2 60 figure 2. ?on? voltages 200 h fe , dc current gain t j = 150 c 1 25 c v ce = 10 v i c , collector current (amps) 0 0.6 1.4 v, voltage (volts) 100 10 40 20 4 6 0.04 0.06 0.2 0.4 0.6 ?55 c 1.2 1 0.8 0.2 0.4 0.02 0.1 2 1 0.04 0.06 0.2 0.4 0.6 t j = 25 c v be(sat) @ i c /i b = 5 v be(on) @ v ce = 4 v v ce(sat) @ i c /i b = 5 v
MJF47 http://onsemi.com 3 0.02 0.05 0.1 2 0.2 5 1 t, time (s) 2 1 0.5 0.1 0.05 0.2 0.5 0.02 figure 3. turn ? on time i c , collector current (amps) 0.01 0.1 2 0.05 figure 4. turn ? off time 1 1 t j = 25 c v cc = 200 v i c /i b = 5 i c , collector current (amps) t r t, time (s) 0.5 0.2 0.1 0.02 0.05 0.2 0.5 t d t j = 25 c v cc = 200 v i c /i b = 5 t s t f turn?on pulse approx +11 v v in 0 v eb(off) t 1 approx +11 v v in t 2 turn?off pulse t 3 t1 7 ns 100 < t 2 < 500 s t 3 < 15 ns duty cycle 2% approx ?9 v r b and r c varied to obtain desired current levels. scope r c r b 51 v cc v in c jd << c eb ?4 v figure 5. switching time equivalent circuit t, time (msec) 1 0.01 0.2 0.2 0.1 0.05 0.02 r(t), transient thermal resistance (normalized) 0.5 10 20 50 100 200 500 1k 2k 5k single pulse r jc(t) = r(t) r jc r jc = 4.4 c/w max t j(pk) ? t c = p (pk) r jc (t) 15 2 10 k 0.5 0.3 0.03 0.1 figure 6. thermal response 0.3 3 30 300 3k
MJF47 http://onsemi.com 4 i c , collector current (amps) 100 s 1ms dc 3 10 v ce , collector?emitter voltage (volts) 300 100 figure 7. maximum forward bias safe operating area 2 1 0.5 0.3 0.2 0.1 0.05 0.03 20 30 50 200 500 s current limit thermal limit @ t c = 25 c secondary breakdown limit there are two limitations on the power handling ability of a transistor: average junction temperature and second breakdown. safe operating area curves indicate i c ? v ce limits of the transistor that must be observed for reliable operation; i.e., the transistor must not be subjected to greater dissipation than the curves indicate. the data of figure 7 is based on t j(pk) = 150 c; t c is variable depending on conditions. second breakdown pulse limits are valid for duty cycles to 10% provided t j(pk) 150 c. t j(pk) may be calculated from the data in figure 6. at high case temperatures, thermal limitations will reduce the power that can be handled to values less than the limitations imposed by second breakdown. 0 t c , case temperature ( c) 0 50 200 20 40 30 10 100 150 figure 8. power derating p d(av) , average power dissipation (watts) 0 t a , ambient temperature ( c) 0 50 200 1 2 1.5 0.5 100 150 figure 9. power derating p d(av) , average power dissipation (watts)
MJF47 http://onsemi.com 5 mounted fully isolated package leads heatsink 0.110" min figure 10. clip mounting position for isolation test number 1 *measurement made between leads and heatsink with all leads shorted together clip clip 0.099" min leads heatsink 0.099" min figure 11. clip mounting position for isolation test number 2 figure 12. screw mounting position for isolation test number 3 mounted fully isolated package mounted fully isolated package leads heatsink test conditions for isolation tests* 4?40 screw plain washer heatsink compression washer nut clip heatsink laboratory tests on a limited number of samples indicate, when using the screw and compression washer mounting technique, a screw torque of 6 to 8 in . lbs is sufficient to provide maximum power dissipation capability. the compression washer helps to maintain a constant pressure on the package over time and during large temperature excursions. destructive laboratory tests show that using a hex head 4 ? 40 screw, without washers, and applying a torque in excess of 20 in . lbs will cause the plastic to crack around the mounting hole, resulting in a loss of isolation capability. additional tests on slotted 4 ? 40 screws indicate that the screw slot fails between 15 to 20 in . lbs without adversely affecting the pack- age. however, in order to positively ensure the package integrity of the fully isolated device, on semiconductor does not reco mmend exceeding 10 in . lbs of mounting torque under any mounting conditions. figure 13. typical mounting techniques* mounting information ** for more information about mounting power semiconductors see application note an1040.
MJF47 http://onsemi.com 6 package dimensions to ? 220 fullpak case 221d ? 03 issue g dim a min max min max millimeters 0.625 0.635 15.88 16.12 inches b 0.408 0.418 10.37 10.63 c 0.180 0.190 4.57 4.83 d 0.026 0.031 0.65 0.78 f 0.116 0.119 2.95 3.02 g 0.100 bsc 2.54 bsc h 0.125 0.135 3.18 3.43 j 0.018 0.025 0.45 0.63 k 0.530 0.540 13.47 13.73 l 0.048 0.053 1.23 1.36 n 0.200 bsc 5.08 bsc q 0.124 0.128 3.15 3.25 r 0.099 0.103 2.51 2.62 s 0.101 0.113 2.57 2.87 u 0.238 0.258 6.06 6.56 ? b ? ? y ? g n d l k h a f q 3 pl 123 m b m 0.25 (0.010) y seating plane ? t ? u c s j r notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch 3. 221d?01 thru 221d?02 obsolete, new standard 221d?03. style 2: pin 1. base 2. collector 3. emitter on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada japan : on semiconductor, japan customer focus center 2 ? 9 ? 1 kamimeguro, meguro ? ku, tokyo, japan 153 ? 0051 phone : 81 ? 3 ? 5773 ? 3850 MJF47/d literature fulfillment : literature distribution center for on semiconductor p.o. box 61312, phoenix, arizona 85082 ? 1312 usa phone : 480 ? 829 ? 7710 or 800 ? 344 ? 3860 toll free usa/canada fax : 480 ? 829 ? 7709 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : http://onsemi.com order literature : http://www.onsemi.com/litorder for additional information, please contact your local sales representative.
|
